New Breakthrough in Precision Drilling Technology for Quartz Glass Plates-sara
2026/09/12
Title: New Breakthrough in Precision Drilling Technology for Quartz Glass Plates
Content:
Our factory has upgraded the combined process of ultrasonic‑assisted drilling and picosecond laser processing for drilled quartz glass plates. We can stably deliver micro‑holes down to 0.1 mm, control hole‑position tolerance within ±0.02 mm, and effectively reduce edge chipping and micro‑cracks on hole entrances and exits.
High‑purity JGS1 / JGS2 fused silica substrates support custom hole arrays, single holes, square holes and special‑shaped through‑holes. The improved processing solution meets stricter requirements from semiconductor equipment, optical instruments and high‑temperature laboratory customers. All finished parts go through full‑inspection under metallurgical microscope before shipment to guarantee consistent batch quality.
Drilled quartz glass plates are widely adopted for gas distribution plates, sample carriers and vacuum fixture components. Thermal shock, residual machining stress and tiny edge chipping are top causes of failure under repeated high‑temperature cycles.
We suggest customers pay attention to three key points:
- Request stress‑relief annealing after drilling to eliminate internal processing stress.
- Control heating‑up speed below 100 °C/min during actual operation.
- Inspect hole edges under microscope before assembly; reject parts with invisible micro‑chipping.
Our technical team provides free processing suggestions for your drawing review at the pre‑sample stage to lower field‑failure risks for end equipment.
To satisfy the growing global demand for custom perforated fused silica parts, we expand our production capacity for drilled quartz glass plates. We support small‑batch prototype sampling as well as mass serial production.
Available customization covers plate dimension, thickness, aperture size, hole‑array layout, double‑sided polishing, chamfering and stress‑relief annealing. Products are applied in wafer processing, optical detection devices, fuel‑cell test benches and material‑science laboratories worldwide. RoHS compliance reports and dimensional inspection certificates can be provided upon request for each shipment.
